| Title | Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones |
| Publication Type | Journal Article |
| Year of Publication | 2012 |
| Authors | Jing-ying L, Xiu-li X, Wen-quan L |
| Journal Title | Waste Management |
| Volume | 32 |
| Pages | 1209 - 1212 |
| ISSN | 0956-053X |
| Keywords | Waste mobile phones |
| Abstract | The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe3+ concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe3+ concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2 h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. |
| URL | http://www.sciencedirect.com/science/article/pii/S0956053X12000402 |
| DOI | 10.1016/j.wasman.2012.01.026 |
Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones
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