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Lead

Leachability of printed wire boards containing leaded and lead-free solder

Publication Type  Journal Article
Year of Publication  2008
Authors  Townsend, T.; Musson, S.; Dubey, B.; Pearson, B.
Journal Title  Journal of Environmental Management
Volume  88
Pages  926-931
Key Words  TCLP; SPLP; Lead; Alternative solder; Toxicity; Leaching
URL  http://www.sciencedirect.com/science/article/B6WJ7-4P127DW-1/1/a9bf5fc1b1db933a21f5edb248e51768

Heavy Metals Concentrations of Surface Dust from e-Waste Recycling and Its Human Health Implications in Southeast China

Publication Type  Journal Article
Year of Publication  2008
Authors  Leung, A.O.W.; Duzgoren-Aydin, N.S.; Cheung, K.C.; Wong, M.H.
Journal Title  Environmental Science & Technology
Pages  ASAP Article, 10.1021/es071873x
ISBN Number  0013-936x
URL  http://pubs3.acs.org/acs/journals/doilookup?in_doi=10.1021/es071873x

Green Electronics through Legislation and Lead Free Soldering

Publication Type  Journal Article
Year of Publication  2008
Authors  Sunil, H.
Journal Title  CLEAN - Soil, Air, Water
Volume  36
Pages  145-151
ISBN Number  1863-0669
URL  http://dx.doi.org/10.1002/clen.200700164
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