<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="6.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Chao Guo</style></author><author><style face="normal" font="default" size="100%">Hui Wang</style></author><author><style face="normal" font="default" size="100%">Wei Liang</style></author><author><style face="normal" font="default" size="100%">Jiangang Fu</style></author><author><style face="normal" font="default" size="100%">Xin Yi</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">Liberation characteristic and physical separation of printed circuit board (PCB)</style></title><secondary-title><style face="normal" font="default" size="100%">Waste Management</style></secondary-title></titles><keywords><keyword><style  face="normal" font="default" size="100%">Physical separation</style></keyword></keywords><dates><year><style  face="normal" font="default" size="100%">2011</style></year></dates><urls><web-urls><url><style face="normal" font="default" size="100%">http://www.sciencedirect.com/science/article/pii/S0956053X11002534</style></url></web-urls></urls><number><style face="normal" font="default" size="100%">9-10</style></number><volume><style face="normal" font="default" size="100%">31</style></volume><pages><style face="normal" font="default" size="100%">2161 - 2166</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><abstract><style face="normal" font="default" size="100%">Recycling of printed circuit board (PCB) is an important subject and to which increasing attention is paid, both in treatment of waste as well as recovery of valuable material terms. Precede physical and mechanical method, a good liberation is the premise to further separation. In this study, two-step crushing process is employed, and standard sieve is applied to screen crushed material to different size fractions, moreover, the liberation situation and particles shape in different size are observed. Then metal of the PCB is separated by physical methods, including pneumatic separation, electrostatic separation and magnetic separation, and major metal contents are characterized by inductively coupled plasma emission spectrometry (ICP-AES). Results show that the metal and nonmetal particles of PCB are dissociated completely under the crush size 0.6</style></abstract></record></records></xml>